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2021 International Workshop on



DIELECTRIC THIN FILMS FOR FUTURE ELECTRON DEVICES
– SCIENCE AND TECHNOLOGY –
 


November 14-16, 2021
On-line virtual

Sponsored by The Japan Society of Applied Physics
Co-sponsored by JSAP Thin Film and Surface Physics Division
Endorsed by JSAP Silicon Technology Division / IEEE EDS Japan Joint Chapter

Paper Submission Deadline: August 20, 2021 

Notice:

Web site for IWDTF2021 has been open. (2021.02.15)
In the 2021 conference, all contributors will be requested to give an oral presentation conforming to 20 min format. Only when we have more contributing papers than expected some papers may be presented in poster format (on-line).

 

IWDTF 2021 Secretariat
E-mail: iwdtf-group@g.ecc.u-tokyo.ac.jp